Home > Tech Data > Plating

In environments with high humidity, and when dissimilar metals are present, it is advised to consider the electrochemical potential between the shield gasket and the metal in contacts. To prevent galvanic action and its corrosive effects at these points of electrical contact, Omega Shielding offers a complete selection of electronic grade platings. Such surface treatment may be considered when the dissimilar metal's potential is great between the gasket and its mating surfaces, or to assure against oxidation in harsh environments.

For example, unplated Beryllium Copper may perform well with the metals in GROUP 2, but tin plating is recommended for use with GROUP 3 metals.

Finish Code Explanation
Finish Code	Finish Required
-20	Bright Finish (Standard Finish)
-50	Bright Gold
-60	Bright Nickel
-61	Matte Nickel
-62	Bright Electroless Nickel
-70	Semi-Bright Silver
-80	Bright Tin Plate
-81	Matte Tin Plate
-90	Bright Zinc Plate
-00

Grouping of Common Metals by Electrochemical Potential
Cathodic 1.	2.	3.	4.	Anodic 5.
Gold	Copper	Tin	Cadmium	Magnesium
Platinum	Bronze	Tin Lead	Zinc
Rhodium	Brass	Aluminum	Galvanized Steel
Graphite	Beryllium Copper	Carbon Steel
Palladium	Stainless Steel
Silver	Steel-400 Series
Titanium	Chromium
Nickel	Tungsten
	Molybdenum

Find a Product

-- Unit of Measure -- Inches Millimeters -- Gap Size -- -- Mount Size -- -- Mount Method --

Resources

• Conductive Adhesive Transfer Tape
• Pressure Sensitive Adhesive Transfer Tape
• Copper Beryllium
• Copper Nickel Tin
• Kimmel Gerke Associates, Ltd.
• IEEE
• RoHS

Contact