Material Highlight: ASTM-B740 Alloy C72650

This material is a copper base alloy with both high strength and high conductivity attributes. It provides excellent performance for shielding strips, contacts and connectors.

Chemical Composition (Weight Percent)

• Nickel - 7.5%
• Tin - 5%
• Copper - 87.5%

Physical Properties

• Electrical Conductivity @ 68°F (20°C) - 14-15% IACS
• Modulus of Elasticity - 18 x 10 psi (12 x 10³ Mpa)
• Density - 0.32 lb./in³ (8.87 gm./cc)

Benefits

• Combines high strength and formability
• High conductivity
• Available in mill hardened or age hardenable
• No distortion during aging, no fixturing
• Excellent solderability and resistance to stress relaxation during high temperature (over 400°F, 200°C) soldering
• Fine grain size
• Excellent corrosion resistance bare and easy to plate when required
• Low initial cost and additional savings during processing

Find a Product

Inches Millimeters

Gap: The space between mounting and mating surfaces when in the compressed position.

Gap Size:

Mount Size: The amount of available space for mounting the part, including space for expansion of product when compressed.

Mount Size:

Mount Method: The desired method of attachment (i.e. clip-on, transfer adhesive, conductive transfer adhesive, solder, weld, or the use of hardware)

Mount Method: -- Mount Method --

Resources

• Conductive Adhesive Transfer Tape
• Pressure Sensitive Adhesive Transfer Tape
• Copper Beryllium
• Copper Nickel Tin
• Kimmel Gerke Associates, Ltd.
• IEEE
• RoHS

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